According to unnamed Asian component manufactures, Microsoft recently stepped up production on the project. In what is essentially a redesigned mainboard, the plan is to reduce the size of the main components from a 90-nanometer process to 65-nanometers. The hardware unit would potentially benefit from producing less power and therefore giving off less heat.
Significantly lowered production costs could also come into play. Current production costs could be cut by up to 50% of its current rate. Many are expecting the console to appear in stores this fall, alongside a price cut on its current model by year’s end.
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